PAD-6[M,R,S1]

  • Concept of Electroless Pd : KemiPalTM PAD-6

  • ※ 균일한 Pd(4 wt.%P) 피막형성
  • ※ Autocatalytic EL-Au bath
  • - Solder joint : SPG-4 (0.06 μm / 10 min.)
  • - Wire bonding : WAD-6 (0.1 μm / 10 min.)
  • ※ 우수한 솔더 접합 신뢰성 및 와이어 본딩성
  • ※ Hana Chem Tech pilot line 적용

ENEPIG Plating Process

Au Wire Pull Test vs. MTO

Hana Chem Tech – ENEPIG Pilot Line

Au Wire Pull Test vs. MTO