Set the substrate-to-substrate gap on the touch monitor (any value above 1mm).

The entered value can be retrieved using Recipe Management.

Compatible with RFID for substrate-specific production tracking (optional).

Substrates are aligned precisely at the copper sulphate plating entrance based on the configured substrate-to-substrate gap value.

After alignment at the copper sulphate plating entrance, the substrates are clamped onto a wire to precisely maintain the substrate-to-substrate gap all the way to the exit. (Maintained to within 1mm.)