Precise and Accurate substrate Gap Control

WCT VCP uses hangers with clamps that attach to a special wire. Because these hangers attach securely to the wire as they move along the plating sector, the gap between substrates that is set at the start of the plating sector is maintained to within ±1mm.

Minimal Plating Thickness Deviation

  • Improved circuit-processing capacity and yield

    High-density circuit line and space

    Impedance

    Fewer hast defects

Easy Maintenance
  • Proactive substrate conveyor drivetrain management
    Automated wire clamp tension measurement
    Digital wire tension display (alarm interlock)
    Substrate-to-substrate gap tracking (in conjunction with RFID, individual unit tracking)

    Fast and easy wire replacement and management

    Pleasant work environment
    Oilless (Non-grease)
    No metal particles generated from chain wear
Simple and Economical Design

  • A simple design that keeps capital requirement to a sensible level.

    Drivetrain is cheaper to maintain compared to conventional chain-driven systems.