|
Degreasing Agents
|
PURICLE N-1
|
Alkaline degreasing agent
Removes contaminants and air pockets from ABS resin for uniform etching and greater hydrophilicity.
|
|
|
Degreasing Agents
|
K-NP 2
|
Acidic degreasing agent
Removes contaminants and air pockets from ABS resin for uniform etching and greater hydrophilicity.
|
|
|
Degreasing Agents
|
PURICLE C-4
|
Excels in cleaning copper (Cu) and copper alloys.
Is cost-effective and can be used for deposition and electrolysis applications.
Copper (Cu) and copper alloy degreasing agent
|
|
|
Degreasing Agents
|
K-CL1000
|
Liquid alkaline degreasing agent for deposition and electrolysis applications.
Superb degreasing on a wide variety of metals
Excels in removing buff abrasives, oils, and contaminants.
|
|
|
Degreasing Agents
|
K-SCL1000
|
Deposition degreasing agent for Al
Excels in removing buff abrasives, oils, and contaminants.
|
|
|
Degreasing Agents
|
PURICLE UST
|
Steel degreasing agent
Eliminates buff gas and grease for the highest adhesion.
Anodic electrolytic degreasing or PR electrolytic degreasing
|
|
|
Degreasing Agents
|
K-MC
|
Acidic Soak-Cleaner K-MC is an acidic deposition degreasing agent exclusively for use on copper (Cu) circuits.
Excels in eliminating organic contaminants and oxides from copper (Cu) circuits.
|
|
|
Etching Agents
|
CWE-1M
|
For etching sintered circuit pattern substrates (tungsten, molybdenum, manganese, etc.).
Ceramic substrate etching agent
|
|
|
Etching Agents
|
G.E
|
Glass and ceramic etching agent
|
|
|
Desmut & Zincate Agents
|
K-ZINC
|
Suitable for high-purity aluminum applications.
Long solution lifespan and a tight zinc-nickel film
Zine substitution agent
|
|
|
Catalysts
|
ST-100
|
Imparts a catalyst nucleus on nonconductor surface.
ST-100 Sn ion type
Chemical plating activator
|
|
|
Catalysts
|
AT-100
|
Imparts a catalyst nucleus on nonconductor surface.
AT-100 Pd ion type
Chemical plating activator
|
|
|
Catalysts
|
AT-90
|
Neutral type
Fine pattern formation
For plating (Pd) patterns on substrates.
|
|
|
Catalysts
|
PTC-CAT (Pd 5g)
|
Sn/Pd colloid
Creates a chemical nickel plating catalyst on the surface of resin that has been anchored through etching.
|
|
|
Catalysts
|
NEOCAT-N (Pd 2g)
|
Sn/Pd colloid
Creates a chemical nickel plating catalyst on the surface of resin that has been anchored through etching.
|
|
|
Masking agents
|
All-Pack
|
Non-plated part, Screen
It's strong against acids and alkalis and easy to peel off
|
|