Soft / Hard gold Process Process Drug name Features Product Summary Degreasing Agents K-MC Acidic Soak-Cleaner K-MC is an acidic deposition degreasing agent exclusively for use on copper (Cu) circuits. Excels in eliminating organic contaminants and oxides from copper (Cu) circuits. Etching Agents K-PS Minute adjustment of copper (Cu) surface illuminance. Electro Nickel K-HANI[1,2] Prevents dispersion of copper (Cu) ions. Nickel Sulfamate plating polish Creates high gloss and low internal stress in nickel sulfamate plating. Soft Gold K-SOGO Superb bonding, corrosion resistance, and electrical conductivity Hard Gold K-HOGO Acidic hard gold plating solution for Au-Co alloys. Superb macro throwing power, wear resistance, and corrosion resistance