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Business

Die Casting Plating

Process

Drug name

Features

Product Summary

Degreasing Agents

K-CL1000

High-alkalinity product [compatible with electro degreasing]

Degreasing Agents

K-SCL1000

Minimal aluminum damage

Degreasing Agents

PURICLE C-4

Suitable for copper and copper alloys [compatible with electro degreasing]

Degreasing Agents

PURICLE UST

Suitable for steel products

Etching Agents

CWE-1M

Suitable for tungsten, molybdenum, and manganese

Etching Agents

G.E

Exclusive for ceramics (including glass)

Desmut

SC-210

Chrome-free product

Effective at lowering wastewater treatment cost

Zincate

K-ZINC

Suitable for high-purity aluminum jobs

Zincate Separation

SC-230

Nitric-acid-free type

Strike

K-CUS

Forms a buffer layer between interfaces to enhance adhesion.

Selective use depending on application

Neutralization

Sulfuric Acid

Surface neutralization and oxide film removal

Glossy Copper Sulphate

DS-COPPER

Excels in plating low-current parts

Superb gloss and leveling

Enables rapid plating

Pickling

Sulfuric Acid

Oxide film removal

Glossy Nickel

ILLUNI

Superb leveling and ductility

Glossy Nickel

HB (High Gloss)

For high-gloss applications

Wide gloss range

Low internal stress

Matte Nickel

Pearl Ni

Forms a uniform satin/matte plating film

Chrome

CTRI (Trivalent White/Black)

Superb covering power and finish

Superb uniform electrodeposition

Superb corrosion resistance and heat resistance

Chrome

Chromic Anhydride (Hexavalent)

Superb finish and corrosion resistance

Posttreatment Coating

EL-POST 3

Forms an electrolytic passivity film

Rack Separation

RS-370

Rapid separation

No etching of the rack’s grounding wire (SUS)