Au Plating
Process |
Drug name |
Features |
Product Summary |
|---|---|---|---|
|
Electroless Gold |
TUD-21 |
A substitutional gold plating bath for ENIG. Forms on top of electroless nickel plating layer. |
|
|
Electroless Gold |
CUD-1 |
A substitutional gold plating bath for ENEPIG. Forms on top of electroless nickel plating layer. |
|
|
Electroless Gold |
WAD-5 |
A reduction gold plating bath for ENEPIG. Processed on top of electroless palladium plating layer. |
|
|
Soft Gold |
K-SOGO |
Superb bonding, corrosion resistance, and electrical conductivity |
|
|
Hard Gold |
K-HAGO |
Acidic hard gold plating solution for Au-Co alloys. Superb macro throwing power, wear resistance, and corrosion resistance |