Electrolytic Cu & Ni Plating
Process |
Drug name |
Features |
Product Summary |
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Copper Sulfate Polishes |
K-COPPER 1 |
Adding just a small amount of the polish creates a mirror-like gloss on a wide range of materials. Insensitive to impurities and convenient replenishing Iron, ABS, nickel, etc. |
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Copper Sulfate Polishes |
HYCURITE-E |
Adding just a small amount of the polish creates a mirror-like gloss on a wide range of materials. Insensitive to impurities and convenient replenishing Iron, ABS, nickel, etc. |
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Copper Sulfate Polishes |
DS-COPPER [M, A, B] |
High gloss, high leveling Has a wide management scope and optimized for automated lines. Iron, ABS, nickel, etc. |
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Electroless and Chemical Nickel |
MPX |
Medium-phosphorus type (P: 7 to 9%) Forms a film capable of withstanding low internal stress on various machinery and industrial parts. Easy to manage the solution. |
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Electroless and Chemical Nickel |
HPN |
High-phosphorus type (P: 9 to 11%) Forms a tight plating layer of uniform thickness. Easy to manage the solution. |
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Electroless and Chemical Nickel |
KLP-1000 |
Neutral, ultra-low-phosphorus type (P: 1 to 3%) Forms an extremely hard film (greater than 700 Hv). |
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Electroless and Chemical Nickel |
K-BORON 70L |
Ni-B type with superior solderability Pb-free. Forms 99%-pure nickel film. |
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Electroless and Chemical Nickel |
UNILAY |
Nickel sulfate type low-temperature alkaline bath Imparts a solid nickel film on the object being plated. |
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Electroless and Chemical Nickel |
CPK |
Nickel sulfate type low-temperature alkaline bath Imparts a solid nickel film on the object being plated to minimize reduction byproducts. |
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Electroless and Chemical Nickel |
K-CHEM CL |
Nickel chloride type low-temperature alkaline bath Imparts a tight nickel film at a low temperature and in a short amount of time for increased productivity (prevents melting of contact points during electroplating). |
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Electrolytic Nickel |
ILLUNI [B-1, B-2] |
Minimizes pit formation. Offers superb covering power for iron, zinc, die casting, and ABS. All-purpose polish for glossy nickel |
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Electrolytic Nickel |
ILLUNI [B-1, B-2] |
Minimizes pit formation. Creates a mirror-like polish in a short amount of time. High-speed polish for glossy nickel |
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Electrolytic Nickel |
LIEBELIGHT SF-1, SF-2 |
Suitable as a gold-plating undercoat. Enables easy plating of terminals and creates a glossy finish. Sulfamic acid nickel polish |
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Electrolytic Nickel |
S-2000 |
Suitable as a gold-plating undercoat. Enables easy plating of terminals and creates a glossy finish. Sulfamic acid nickel polish |
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Electrolytic Nickel |
LUXNIC S [70, 75, D-2] |
Imparts high leveling and semi-gloss finish. Low internal stress and minimal impurity generation. Semi-gloss nickel polish |
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Electrolytic Nickel |
LIEBELIGHT K-0 |
Lead frames and terminals Thickness plating and semi-gloss film Sulfamic acid nickel polish |
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Electrolytic Nickel |
PEARL Ni [A, B, C-PLUS] |
Exclusively for use on rack processes and is applicable to chrome, black nickel, and old-fashioned nickel. Able to create varying degrees of gloss by adjusting the amount of additive used. Matte nickel additive |