Electroless Tin Plating Process Process Drug name Features Product Summary Degreasing Agents K-MC Acidic Soak-Cleaner K-MC is an acidic deposition degreasing agent exclusively for use on copper (Cu) circuits. Excels in eliminating organic contaminants and oxides from copper (Cu) circuits. Etching Agents K-PS Minute adjustment of copper (Cu) surface illuminance. Pre-dip K-TIN[M,A,B] Forms a uniform surface and has a safe solution lifespan. Can be used for both vertical and horizontal applications. Electroless Tin K-TIN[M,A,B] Forms a uniform surface and has a safe solution lifespan. Can be used for both vertical and horizontal applications.