ENIG Process
Process |
Drug name |
Features |
Product Summary |
|---|---|---|---|
|
Degreasing Agents |
K-MC |
Acidic Soak-Cleaner K-MC is an acidic deposition degreasing agent exclusively for use on copper (Cu) circuits. Excels in eliminating organic contaminants and oxides from copper (Cu) circuits. |
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Etching Agents |
K-PS |
Minute adjustment of copper (Cu) surface illuminance. |
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Catalyst Agents |
AC-1K |
Electroless nickel plating activator (high-concentration Pd type). A sulfuric-acid-type activator that does not contain chloride ions (Cl-). |
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|
Anti-spread Agents |
K-RAP |
Effectively makes, via the binder, Pd that was over-adsorbed on metal seed and resin during the activator process to prevent bridges and other defects. Does not include CN or other materials that are hazardous to the environment. |
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Wetting Agents |
K-NW |
Improves wetness and maintains uniform plating (electroless nickel additive). |
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Electroless Nickel |
MPN-6 |
NikenTM MPN-6 is a medium-phosphorus (6 to 9 wt.%) electroless nickel plating bath for use on PCBs and package substrates. |
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Electroless Nickel |
NLD-5 |
NDL-5 is an electroless nickel plating bath for use on flexible substrates requiring high ductility. It is a medium-phosphorus (6 to 9 wt.%) electroless nickel plating bath with superb solution stability. |
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Electroless Gold |
TUD-21 |
A substitutional gold plating bath for ENIG. Forms on top of electroless nickel plating layer. |