Preprocessing
Process |
Drug name |
Features |
Product Summary |
|---|---|---|---|
|
PSR Pre-elution |
K-BIL |
PCB PSR Eluent Excels in PSR elution prior to plating. |
|
|
Degreasing Agents |
K-MC |
Acidic Soak-Cleaner K-MC is an acidic deposition degreasing agent exclusively for use on copper (Cu) circuits. Excels in eliminating organic contaminants and oxides from copper (Cu) circuits. |
|
|
Etching Agents |
K-PS |
Minute adjustment of copper (Cu) surface illuminance. |
|
|
Catalyst Agents |
AC-1K |
Electroless nickel plating activator (high-concentration Pd type). A sulfuric-acid-type activator that does not contain chloride ions (Cl-). |
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|
Catalyst Agents |
ATS-1 |
A sulfuric-acid-type activator that does not contain chloride ions (Cl-). Copper (Cu) concentration has little effect on how much the amount of Pd adsorption changes, making it possible to maintain Pd adsorption level at a consistent level even during prolonged use. |
|
|
Anti-spread Agents |
K-RAP |
Effectively makes, via the binder, Pd that was over-adsorbed on metal seed and resin during the activator process to prevent bridges and other defects. Does not include CN or other materials that are hazardous to the environment. |