Anodizing
Process |
Drug name |
Features |
Product Summary |
|---|---|---|---|
|
Degreasing Agents |
K-SCL1000 |
Minimal aluminum damage |
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|
cyanide bronze |
K-CUS |
Strike and thickness plating to give the material adhesion. |
|
|
Etching Agents |
PURICLE C-4 |
Imparts surface adhesion and partial erosion through micro etching. |
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|
Chemical Polishing[semi-gloss finish] |
K-CP100 |
Nitric-acid-free product that does not generate NOx gas. |
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|
Chemical Polishing[gloss finish] |
K-CP200 |
Nitric-acid-free product that does not generate NOx gas. |
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|
Chemical Polishing[High-Gloss finish] |
K-CP300 |
Nitric-acid-free product that does not generate NOx gas. |
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|
Chemical Sanding |
AL SATIN 25 |
Lighter shell and pearl sanding |
|
|
Desmut |
SC-240 |
Smut removal |
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|
Anodizing |
K-AL100 |
Accelerates film formation. |
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Surface Conditioning |
K-TK10 |
Removes microscopic grooves, thread grooves, and residual sulfuric acid. |
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Coloring |
K-B1 |
Accelerates coloring. |
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Dye |
black and others |
Contact Sales Team. |
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Pre-sealing |
K-NB1 |
Prevents color loss after coloring. |
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Nickel-sealing Agents |
K-HT1 |
Forms a coating layer on colored material. |
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Nickel-sealing Agents |
SEALING AGENT(Powder) |
1st sealing agent for anodizing applications Nickel-acetate type offering the greatest durability by sealing inside the oxide film. |
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|
Elution |
K-NF200 |
Eliminates residual nickel from oxide film surface. Special surfactant plays the role of blocking sealing pores on oxide film holes. |
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|
Coating Removal |
BR Solution |
Removes aluminum oxide film. Minimal aluminum damage |