ENEPIG Process
Process |
Drug name |
Features |
Product Summary |
|---|---|---|---|
|
PSR Pre-elution |
K-BIL |
PCB PSR Eluent Excels in PSR elution prior to plating. |
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|
Degreasing Agents |
K-MC |
Acidic Soak-Cleaner K-MC is an acidic deposition degreasing agent exclusively for use on copper (Cu) circuits. Excels in eliminating organic contaminants and oxides from copper (Cu) circuits. |
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|
Etching Agents |
K-PS |
Minute adjustment of copper (Cu) surface illuminance. |
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|
Catalyst Agents |
ATS-1 |
A sulfuric-acid-type activator that does not contain chloride ions (Cl-). Copper (Cu) temperature has little effect on how much the amount of Pd adsorption changes, making it possible to maintain Pd adsorption level at a consistent level even during prolonged use. |
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|
Anti-spread Agents |
K-RAP |
Effectively makes, via the binder, Pd that was over-adsorbed on metal seed and resin during the activator process to prevent bridges and other defects. Does not include CN or other materials that are hazardous to the environment. |
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|
Wetting Agents |
K-NW |
Improves wetness and maintains uniform plating (electroless nickel additive). |
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|
Electroless Nickel |
MPN-6 |
NikenTM MPN-6 is a medium-phosphorus (6 to 9 wt.%) electroless nickel plating bath for use on PCBs and package substrates. |
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|
Electroless Palladium |
PAD-6 |
A self-catalyst electroless palladium plating bath that extracts a uniform Pd film on top of Ni film. Produces superb solder bonding and wire bonding reliability when used together with MPN-6 (nickel plating bath) and electroless gold plating WAD-5. |
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|
Electroless Gold |
CUD-1 |
A substitutional gold plating bath for ENEPIG. Forms on top of electroless nickel plating layer. |
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Electroless Gold |
WAD-5 |
A reduction gold plating bath for ENEPIG. Processed on top of electroless palladium plating layer. |