Ni plating
Process |
Drug name |
Features |
Product Summary |
|---|---|---|---|
|
Wetting Agents |
K-NW |
Improves wetness and maintains uniform plating (electroless nickel additive). |
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Electroless Nickel |
MPN-6 |
NikenTM MPN-6 is a medium-phosphorus (6 to 9 wt.%) electroless nickel plating bath for use on PCBs and package substrates. |
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Electroless Nickel |
NLD-5 |
NDL-5 is an electroless nickel plating bath for use on flexible substrates requiring high ductility. It is a medium-phosphorus (6 to 9 wt.%) electroless nickel plating bath with superb solution stability. |
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Electro Nickel |
K-HANI[1,2] |
Prevents dispersion of copper (Cu) ions. Nickel Sulfamate plating polish Creates high gloss and low internal stress in nickel sulfamate plating. |