Intenna Plating
Process |
Drug name |
Features |
Product Summary |
|---|---|---|---|
|
Degreasing Agents |
K-CL1000 |
Imparts surface wetness to prevent air pocket formation. Surface cleaning |
|
|
Etching Agents |
K-PS |
Anchor formation on ABS surface |
|
|
Neutralization |
K-NE02 |
Reduction of residual hexavalent chrome |
|
|
Pre-dip |
Hydrochloric Acid |
Activity-1 chemical protection |
|
|
Activity-1 |
PTC-CAT/NEOCAT-N |
Sn/Pd catalyst adsorption |
|
|
Activity-2 |
K-ACC38 |
Selective Sn ion removal |
|
|
Copper Strike |
K-ECU |
Imparts conductivity to a nonconductor. Forms a buffer layer between interfaces to enhance adhesion. |
|
|
Electroless Copper |
K-ECU |
Forms a copper-plating layer in the pattern area. Superb gloss and levelness. |
|
|
Pre-dip |
Sulfuric Acid |
Pd activity chemical protection Oxide film removal from copper-plating surface |
|
|
Pd Activity |
K-PD |
Pd catalyst adsorption on copper surface |
|
|
Electroless Nickel |
K-LTEN |
Forms a nickel-plating layer in the pattern area. Superb gloss and uniform electrodeposition |
|
|
Anti-discoloration |
K-WD |
Superb product staining and discoloration prevention |