P.O.P PROCESS
https://kpmtech.co.kr/enDS COPPER[M,A,B]
Concept of Acid Copper Plating : DS-Copper
- ※ Has superb malleability and acts as a shock absorber between the material and the nickel layer.
- ※ Reduced absorption of stress caused by thermal expansion and contraction.
- ※ Maximum adhesion with the material.
- ※ Extremely superb gloss and leveling.
SEM Analysis
KPM POP Process
Effect of Consumption as per Temperature
