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• Concept of Electroless Pd : KemiPalTM PAD-6

• ※ Creates a uniform Pd (4 wt.%P) film.
• ※ Autocatalytic EL-Au bath
• - Solder Joint: SPG-4 (0.06 μm/10 min)
• - Wire Bonding: WAD-6 (0.1 μm/10 min)
• ※ Superior solder joint reliability and wire bonding.
• ※ Hana Chem Tech pilot line applied.

ENEPIG Plating Process

Hana Chem Tech – ENEPIG Pilot Line